Advanced Materials for Thermal Management of Electronic Packaging (Registro nro. 13913)
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| 000 -CABECERA | |
|---|---|
| Campo de control de longitud fija | 07081nam a2200313za04500 |
| 001 - NÚMERO DE CONTROL | |
| Campo de control | 17288 |
| 008 - CAMPO FIJO DE DESCRIPCIÓN FIJA--INFORMACIÓN GENERAL | |
| Campo de control de longitud fija | 050703s2011 xxu eng d |
| 020 ## - ISBN (INTERNATIONAL STANDARD BOOK NUMBER) | |
| ISBN | 9781441977595 99781441977595 |
| 082 ## - NÚMERO DE LA CLASIFICACIÓN DECIMAL DEWEY | |
| Número de clasificación Decimal | 621.3815 |
| Número de documento (Cutter) | 223 |
| 100 ## - ENCABEZAMIENTO PRINCIPAL--NOMBRE PERSONAL | |
| Nombre de persona | Tong, Xingcun Colin. |
| Término relacionador | author. |
| 9 (RLIN) | 35322 |
| 245 ## - TÍTULO PROPIAMENTE DICHO | |
| Título | Advanced Materials for Thermal Management of Electronic Packaging |
| Medio físico | [electronic resource] / |
| Mención de responsabilidad, etc. | by Xingcun Colin Tong. |
| 300 ## - DESCRIPCIÓN FÍSICA | |
| Extensión | XXII, 618 p. |
| Otros detalles físicos | online resource. |
| 490 ## - MENCIÓN DE SERIE | |
| Mención de serie | Springer Series in Advanced Microelectronics |
| 490 ## - MENCIÓN DE SERIE | |
| ISSN | -1437-0387 ; |
| Número de volumen/designación secuencial | -30 |
| 505 ## - NOTA DE CONTENIDO FORMATEADA | |
| Nota de contenido con formato preestablecido | CH. 1. Thermal managing fundamentals and design guide in electronic packaging -- 1.1 Introduction -- 1.2 Thermal management challenges and common -- concerns -- 1.3 Fundamentals of heat transfer -- 1.4 Thermal management solutions -- 1.5 Design for advanced thermal management of electronic packaging -- 1.6 Materials selection for advanced thermal management -- 1.7 Environmental compliance of thermal managing materials -- CH. 2. Characterization methodology of thermal managing materials -- 2.1 Thermal properties and measurement techniques -- 2.2 Electrical properties and measurement techniques -- 2.3 Thermomechanical characterization -- 2.4 Analytical techniques for materials characterization -- 2.5 Surface finish and contact interface compatibility -- 2.6 Reliability analysis and environmental performance evaluation -- CH. 3. Electronic packaging materials and their thermal managements -- 3.1 Materials selection for electronic packaging -- 3.2 Ceramics and semiconductors -- 3.3 Electronic glasses -- 3.4 Polymers -- 3.5 Monolithic metals -- 3.6 Metallic composites -- 3.7 Multimaterial laminates -- 3.8 Printed Circuit Board (PCB) Materials -- 3.9 Thermal interface materials -- 3.10 Advanced thermally conductive materials -- CH. 4. THERMALLY conductive carbonaceous materials and carbon matrix composites -- 4.1 Introduction -- 4.2 Natural and industrial graphite -- 4.3 Pyrolytic graphite -- 4.4 Graphite/Carbon Foams -- 4.5 Thermally conductive carbon fibers -- 4.6 Diamond -- 4.7 Carbon Nanotubes -- 4.8 Carbon/carbon composites -- CH. 5. Thermally conductive polymer matrix composites -- 5.1 Introduction -- 5.2 Polymer matrix types -- 5.3 Reinforcements selection and its effect on thermal conductivity -- 5.4 General fabrication and manufacturing processes -- 5.5 Types and applications for thermal management -- CH. 6. High thermal conductivity metal matrix composites -- 6.1 Introduction -- 6.2 Processing of metal matrix composites -- 6.3 Aluminum matrix composites -- 6.4 Copper matrix composites -- 6.5 Other metal matrix composites -- CH. 7. Thermally conductive ceramic matrix composites -- 7.1 Introduction -- 7.2 Diamond-SiC composites -- 7.3 Carbon-SiC Composites -- 7.4 Reaction-Bonded SiC -- 7.5 Aluminum-toughened SiC -- 7.6 CNT/Ceramic- carbon nanotube composites -- CH. 8. Thermal interface materials in electronic packaging -- 8.1 Thermal contact conductance and requirement for thermal interface materials -- 8.2 Metallic thermal interface materials -- 8.3 Thermal grease -- 8.4 Thermally conductive elastomer materials -- 8.5 Phase change materials -- 8.6 Polymer solder hybrid materials -- 8.7 Fiber-reinforced thermal interface materials -- 8.8 Graphite based thermal interface material -- 8.9 Nanotechnology based thermal interface materials -- 8.10 Thermal interface materials selection -- CH. 9. Materials and design of advanced heat spreader and air cooling heat sink -- 9.1 Introduction -- 9.2 Spreading and constriction resistance -- 9.3 Type of heat spreaders and their materials selection -- 9.4 Air cooling heat sink -- 9.4.1 Heat sink design constraints and design parameters -- 9.5 Nanostructure heat sink and complex spreader sink -- CH. 10. Liquid cooling devices and materials selection -- 10.1 Introduction -- 10.2 Indirect single-phase liquid cooling -- 10.3 Direct immersion cooling -- 10.4 Spray cooling and jet impingement -- 10.5 Heat pipe cooling -- 10.6 Refrigeration cooling -- 10.7 High-flux cooling with phase-change heat transfer -- CH. 11. Thermoelectric cooling through thermoelectric materials -- 11.1 Introduction -- 11.2 Thermoelectric effects -- 11.3 Design and architecture of thermoelectric cooling devices -- 11.4 Thermoelectric materials and future development trends -- CH. 12. Development and applications of advanced thermal managing materials -- 12.1 Materials development routine and methodology -- 12.2 Smart composites and multifunctional materials for thermal management -- 12.3 Thermal managing materials with enhanced EMI shielding and absorbing performance -- 12.4 Applications -- 12.5 Future trends.-. |
| 520 ## - RESUMEN, ETC. | |
| Nota de sumario, etc. | The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging. Key Features: Covers ceramics and glasses, polymers, metals, metallic composites, multi-material laminates, carbonaceous materials, and carbon-matrix composites Provides the reader with a comprehensive understanding of thermal management solutions Includes fundamentals of heat transfer and materials characterization techniques Assesses cost and performance in thermal management |
| 650 ## - ASIENTO SECUNDARIO DE MATERIA--TÉRMINO DE MATERIA | |
| Nombre de materia o nombre geográfico como elemento de entrada | Engineering. |
| 9 (RLIN) | 96 |
| 650 ## - ASIENTO SECUNDARIO DE MATERIA--TÉRMINO DE MATERIA | |
| 9 (RLIN) | 33899 |
| Nombre de materia o nombre geográfico como elemento de entrada | OPTICAL AND ELECTRONIC MATERIALS |
| 650 ## - ASIENTO SECUNDARIO DE MATERIA--TÉRMINO DE MATERIA | |
| 9 (RLIN) | 33897 |
| Nombre de materia o nombre geográfico como elemento de entrada | OPRICAL MATERIALS |
| 650 ## - ASIENTO SECUNDARIO DE MATERIA--TÉRMINO DE MATERIA | |
| 9 (RLIN) | 34526 |
| Nombre de materia o nombre geográfico como elemento de entrada | ELECTRONIC CIRCUITS AND DEVICES |
| 650 ## - ASIENTO SECUNDARIO DE MATERIA--TÉRMINO DE MATERIA | |
| 9 (RLIN) | 34207 |
| Nombre de materia o nombre geográfico como elemento de entrada | PHYSICS |
| 650 ## - ASIENTO SECUNDARIO DE MATERIA--TÉRMINO DE MATERIA | |
| 9 (RLIN) | 34207 |
| Nombre de materia o nombre geográfico como elemento de entrada | PHYSICS |
| 650 ## - ASIENTO SECUNDARIO DE MATERIA--TÉRMINO DE MATERIA | |
| 9 (RLIN) | 33702 |
| Nombre de materia o nombre geográfico como elemento de entrada | ENGINEERING THERMODYNAMICS, HEAT AND MASS TRANSFER |
| 650 ## - ASIENTO SECUNDARIO DE MATERIA--TÉRMINO DE MATERIA | |
| 9 (RLIN) | 33664 |
| Nombre de materia o nombre geográfico como elemento de entrada | ELECTRONICS AND MICROELECTRONICS, INDTRUMENTATION |
| 650 ## - ASIENTO SECUNDARIO DE MATERIA--TÉRMINO DE MATERIA | |
| 9 (RLIN) | 33659 |
| Nombre de materia o nombre geográfico como elemento de entrada | ELECTRONICS |
| 710 ## - ENCABEZAMIENTO SECUNDARIO--NOMBRE CORPORATIVO | |
| Nombre corporativo o de jurisdicción como elemento de entrada | SpringerLink (Online service) |
| 9 (RLIN) | 111 |
| 856 ## - ACCESO ELECTRÓNICO | |
| Identificador uniforme del recurso URI | <a href="http://springer.escuelaing.metaproxy.org/book/10.1007/978-1-4419-7759-5">http://springer.escuelaing.metaproxy.org/book/10.1007/978-1-4419-7759-5</a> |
| Texto del enlace | ir a documento |
| Tipo de formato electrónico | URL |
| 942 ## - ELEMENTOS KOHA | |
| Fuente de clasificación o esquema de ordenación en estanterías | |
| Koha tipo de item | DOCUMENTOS DIGITALES |
| Disponibilidad | Mostrar en OPAC | Fuente de clasificación o esquema | Tipo de Descarte | Restricciones de uso | Estado | Código de colección | Localización permanente | Localización actual | Fecha adquisición | Proveedor | Forma de Adq | Precio normal de compra | Datos del ítem (Volumen, Tomo) | Préstamos totales | Signatura completa | Código de barras | Fecha última consulta | Número de ejemplar | Propiedades de Préstamo KOHA | Programa Académico |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Préstamo Normal | Digital | Biblioteca Jorge Álvarez Lleras | Biblioteca Jorge Álvarez Lleras | 2014-03-20 | Springer-444444025-OS1549 | Compra | 13770.00 | Ej. 1 | 621.3815 223 | D000550 | 2014-10-14 | 1 | DOCUMENTOS DIGITALES | Biblioteca |
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