Reliability of Microtechnology [electronic resource]: Interconnects, Devices and Systems / by Johan Liu, Olli Salmela, Jussi Sarkka, James E. Morris, Per-Erik Tegehall, Cristina Andersson.

Por: Liu, Johan [author.]Colaborador(es): Salmela, Olli | [author.] | Sarkka, Jussi | [author.] | Morris, James E | [author.] | Tegehall, Per-Erik | [author.] | Andersson, Cristina | [author.] | SpringerLink (Online service)Tipo de material: TextoTextoEdición: 1Descripción: XIII, 204p. 50 illus. online resourceISBN: 9781441957603 99781441957603Tema(s): Engineering | Engineering | OPTICAL AND ELECTRONIC MATERIALS | OPRICAL MATERIALS | NANOTECHNOLOGY AND MICROENGINEERING | ELECTRONICS AND MICROELECTRONICS, INDTRUMENTATION | ELECTRONICS | SYSTEMS SAFETY | QUALITY CONTROL, REABILITY, SAFETY AND RISKClasificación CDD: 621.381 Recursos en línea: ir a documento
Contenidos:
Introduction to Reliability and its Importance -- Reliability Metrology -- General Failure Mechanisms of Microsystems -- Solder and Conductive Adhesive Joint Reliability -- Accelerated Testing -- Reliability Design for Manufacturability -- Component Reliability -- System Level Reliability -- Reliability and Quality Management of Microsystem -- Experimental Tools for Reliability Analysis.
Resumen: Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also: Discusses the general failure mechanisms of microsystems on a component level Offers comprehensive coverage of solder joint reliability at the microsystems level Analyzes quality issues and manufacturing at the microsystems level Reliability of Microtechnology is an ideal volume for researchers and professional engineers working in reliability and manufacturing. The book also includes exercises and detailed solutions at the end of each chapter.
Etiquetas de esta biblioteca: No hay etiquetas de esta biblioteca para este título. Ingresar para agregar etiquetas.
    Valoración media: 0.0 (0 votos)
Tipo de ítem Ubicación actual Colección Signatura Info Vol Copia número Estado Fecha de vencimiento Código de barras Reserva de ítems
DOCUMENTOS DIGITALES DOCUMENTOS DIGITALES Biblioteca Jorge Álvarez Lleras
Digital 621.381 223 (Navegar estantería) Ej. 1 1 Disponible D000653
Total de reservas: 0

Introduction to Reliability and its Importance -- Reliability Metrology -- General Failure Mechanisms of Microsystems -- Solder and Conductive Adhesive Joint Reliability -- Accelerated Testing -- Reliability Design for Manufacturability -- Component Reliability -- System Level Reliability -- Reliability and Quality Management of Microsystem -- Experimental Tools for Reliability Analysis.

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also: Discusses the general failure mechanisms of microsystems on a component level Offers comprehensive coverage of solder joint reliability at the microsystems level Analyzes quality issues and manufacturing at the microsystems level Reliability of Microtechnology is an ideal volume for researchers and professional engineers working in reliability and manufacturing. The book also includes exercises and detailed solutions at the end of each chapter.

No hay comentarios en este titulo.

para colocar un comentario.