Silicon Carbide Microsystems for Harsh Environments [electronic resource] / by Muthu B.J. Wijesundara, Robert Azevedo.
Tipo de material: TextoSeries MEMS Reference Shelf; -22Descripción: XVI, 232 p. online resourceISBN: 9781441971210 99781441971210Tema(s): Engineering | Engineering | NANOTECHNOLOGY AND MICROENGINEERING | ELECTRONICS AND MICROELECTRONICS, INDTRUMENTATION | CIRCUITS AND SYSTEMS | ELECTRONICS | SYSTEMS ENGINEERINGClasificación CDD: 621.381 Recursos en línea: ir a documentoTipo de ítem | Ubicación actual | Colección | Signatura | Info Vol | Copia número | Estado | Fecha de vencimiento | Código de barras | Reserva de ítems |
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DOCUMENTOS DIGITALES | Biblioteca Jorge Álvarez Lleras | Digital | 621.381 223 (Navegar estantería) | Ej. 1 | 1 | Disponible | D000688 |
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621.381 223 Reliability of Microtechnology | 621.381 223 MEMS Reliability | 621.381 223 MEMS Linear and Nonlinear Statics and Dynamics | 621.381 223 Silicon Carbide Microsystems for Harsh Environments | 621.381 223 MEMS Materials and Processes Handbook | 621.381 223 Microelectronic Test Structures for CMOS Technology | 621.381 223 Semiconductor Power Devices |
Introduction to Harsh MEMs -- Silicon Carbide Processing -- Silicon Carbide Electronics -- Silicon Carbide MEMS Devices -- Silicon Carbide MEMs Device Packaging -- System Integration.
<p><em>Silicon Carbide Microsystems for Harsh Environments</em> reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments. Technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation are discussed at length. The authors use the SiC technology platform suite as the model platform for developing harsh environment Microsystems, and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods towards system level integration of components and key challenges are evaluated and discussed based on the current state of SiC materials processing and device technology. Issues such as temperature mismatch, process compatibility and temperature stability of individual components and how these issues manifest when building the system receive thorough investigation. This book also: </p> <ul> <li>Addresses the SiC platform for complete microsystems and goes beyond the individual device level</li> <li>Provides a comprehensive collection of SiC technologies information relevant to harsh environment microsystems</li> <li>Covers the challenges in combining SiC process and components to a microsystem</li> <li>Discusses power source and signal transmission issues in the context of the harsh environment application space </li> </ul> <p><em>Silicon Carbide Microsystems for Harsh Environments</em> not only reviews the state-of-the-art MEMS devices, but also provides a framework for the joining of electronics and MEMS along with packaging into usable harsh-environment-ready sensor modules.</p>
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