1 SCOPE
1.1 Purpose ................................................................... 1
1.2 Intent ....................................................................... 1
1.3 Printed Electronics Document Hierarchy .............. 1
1.4 Qualification ........................................................... 2
1.5 Procurement Documentation .................................. 2
1.6 As Agreed Upon Between User and Supplier
(AABUS) ................................................................ 2
1.7 Interpretation .......................................................... 2
1.8 Presentation ............................................................ 2
2 APPLICABLE DOCUMENTS ...................................... 2
2.1 IPC .......................................................................... 2
2.2 NCSL International ................................................ 2
2.3 ISO .......................................................................... 2
3 TERMS AND DEFINITIONS ........................................ 3
3.1 base material* ........................................................ 3
3.2 barrier ..................................................................... 3
3.3 fiducial mark .......................................................... 3
3.4 functional biologically active material .................. 3
3.5 functional chemically active material .................... 3
3.6 functional conductive material .............................. 3
3.7 functional dielectric material ................................. 3
3.8 functional material ................................................. 3
3.9 functional optically active material ....................... 3
3.10 functional semiconductive material ....................... 3
3.11 functional thermally active material ...................... 4
3.12 hybrid structure ...................................................... 4
3.13 in-body .................................................................... 4
3.14 nonfunctional material ........................................... 4
3.15 nonprinted conductor ............................................. 4
3.16 on-body ................................................................... 4
3.17 printed electronics based devices .......................... 4
3.18 printed electronics based material ......................... 4
3.19 printed electronics based process .......................... 4
3.20 printed electronics based final products ................ 4
3.21 printed electronics based modules and units ......... 4
3.22 printed electronics through-hole ............................ 4
3.23 printed electronics via ............................................ 4
3.24 surface finish .......................................................... 4
4 DESIGN PROCESS FLOW ......................................... 5
4.1 Printed Electronics Design Process Flow Stages .. 5
4.1.1 Function and Purpose Definition ........................... 6
4.1.2 Performance Specifications .................................... 7
4.1.3 Materials Selections ............................................... 8
4.1.4 Design and Architecture ........................................ 9
4.1.5 Manufacturing Process Layout ............................ 18
4.1.6 Cost Analysis ........................................................ 20
4.1.7 Final Device, Module and Unit, and Product ..... 21
5 NOTES ....................................................................... 23
5.1 Data Conversion Initiative Background .............. 23
6 REFERENCES ........................................................... 23

This guideline provides an overview of the design process flow for printed electronics based devices, modules and units, and final products.