000			02189nam a2200265za04500
001			17105
008			050703s2011 xxu eng d
020			_a9781441972767 99781441972767
082			_a621.3815 _b223
245			_aUltra-thin Chip Technology and Applications _h[electronic resource] / _cedited by Joachim Burghartz.
300			_aXXII, 467p. 252 illus., 157 illus. in color. _bonline resource.
505			_aFabrication technologies for ultra-thin chips -- Post-processing techniques and issues -- Properties of ultra-thin chips; Applications.
520			_aUltra-thin Chip Technology and Applications edited by: Joachim N. Burghartz Ultra-thin chip technology has the potential to provide solutions for overcoming bottlenecks in silicon technology and for leading to new applications. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, assembly, characterization, modeling and applications of ultra-thin chips. Provides a comprehensive overview of the challenges in ultra-thin chip fabrication, post processing, properties and applications by leaders in the field sharing their newest results and ideas; Compares strengths and weaknesses of three generic fabrication processes for ultra-thin chips; Describes electronic, mechanical, optical, and thermal properties of ultra-thin chips that are different from those of conventional, thick chips; Shows that thin chip technology and its applications represents a new paradigm in silicon technology.
650			_aEngineering. _996
650			_aEngineering. _996
650			_933761 _aCOMPUTER, AIDED ENGINEERING (CAD, CAE) AND DESIGN
650			_933757 _aCOMPUTER AIDED DESIGN
650			_933660 _aCIRCUITS AND SYSTEMS.
650			_933673 _aSYSTEMS ENGINEERING
700			_aBurghartz, Joachim. _936074
700			_eeditor. _936075
710			_aSpringerLink (Online service) _9111
856			_uhttp://springer.escuelaing.metaproxy.org/book/10.1007/978-1-4419-7276-7 _yir a documento _qURL
942			_2ddc _cCF
999			_c13871 _d13871