Terms and Definitions for Interconnecting and Packaging Electronic Circuits /
a standard developend by IPC
- Illinois (USA) : IPC, 2011
- 118 p. : il. ; 28 cm.
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry acronyms.
CIRCUITOS--NORMAS
TARJETAS DE CIRCUITOS--NORMAS
621.3815 / IPC-T-50K
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry acronyms.
CIRCUITOS--NORMAS
TARJETAS DE CIRCUITOS--NORMAS
621.3815 / IPC-T-50K