Terms and Definitions for Interconnecting and Packaging Electronic Circuits / a standard developend by IPC - Illinois (USA) : IPC, 2011 - 118 p. : il. ; 28 cm.

This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry acronyms.


CIRCUITOS--NORMAS
TARJETAS DE CIRCUITOS--NORMAS

621.3815 / IPC-T-50K