Terms and Definitions for Interconnecting and Packaging Electronic Circuits / a standard developend by IPC
Por: IPC Association Connecting Electronic Industries
Tipo de material: 
TextoEditor: Illinois (USA) : IPC, 2011Descripción: 118 p. : il. ; 28 cmTema(s): CIRCUITOS -- NORMAS | TARJETAS DE CIRCUITOS -- NORMASClasificación CDD: 621.3815 Resumen: This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry acronyms.
| Tipo de ítem | Ubicación actual | Colección | Signatura | Info Vol | Copia número | Estado | Fecha de vencimiento | Código de barras | Reserva de ítems |
|---|---|---|---|---|---|---|---|---|---|
LIBRO - MATERIAL GENERAL
|
Biblioteca Jorge Álvarez Lleras Fondo general | Colección / Fondo / Acervo / Resguardo | 621.3815 IPC-T-50K (Navegar estantería) | Ej. 1 | 1 | Disponible | 023698 |
Total de reservas: 0
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry acronyms.
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